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Title: Enhancing Reliability In A Multi-Function Calibrator Using Thermal Design
Author: Howard Voorheis
Source: 1988 Measurement Science Conference
Year Published: 1988
Abstract: The failure rates of semiconductor devices have been directly related to junction temperatures. Thus, the reliability of a semiconductor device can be enhanced by lowering it5 junction temperature. In a complex electronic instrument where substantial amounts of power are dissipated, temperature control becomes necessary. For this to happen, however, thermal design must be incorporated into the system design of the instrument from the very start. To treat thermal problems after the fact can create t-eal problems in electrical, mechanical, and scheduling areas of the project. This paper describes the thermal problems in the design of a complex multifunction calibrator and a solution methodology that was used to reduce the device junction temperatures in the instrument.

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